Capabilities
Capability | Details |
Materials | FR-1, FR-4, CEM-1, CEM-3, Al-based, Ceramic-based |
Layer Coverage | Single Sided, Double Sided, 4/L - 16/L Multi |
Board Thickness | 0.4mm-3.2mm |
Copper Cladding | 1/3oz-12oz (Inner), 1/3oz-6oz (Outer) |
Minimum Trace | 0.1/0.1mm(min) (Width/Spacing) |
Min. Hole Size | 0.2mm finished mechanical |
Hole Size Tolerance | +/-0.075mm (PTH), +/-0.05mm (NPTH),+/-0.10mm(SLOT) |
Aspect Ratio | Visa < 12:1 |
Surface Treatment | HAL, HAL Lead Free, Immersion Silver, Immersion Gold, OSP |